Packaging & Assembly
Advanced-packaging economics and engineering — CoWoS, 3D-IC, HBM stacks, interposers and thermal interface materials for the AI accelerator era.
Package Cost Calculator
Estimate semiconductor packaging expenses across wire-bond, flip-chip, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) technologies. Incorporates substrate material costs, bonding equipment rates, and inspection overhead for accurate BOM and COGS modeling.
CoWoS Cost Calculator
Analyze TSMC CoWoS packaging costs and production economics for AI accelerators and HPC chips, including interposer pricing, HBM stacking, and yield loss factors. Models CoWoS-S, CoWoS-R, and CoWoS-L variants with substrate scarcity and capacity constraint adjustments.
3D IC Calculator
Evaluate 3D integrated circuit designs with through-silicon via (TSV) density modeling, hybrid bonding yield analysis, and thermal-stacking constraints. Supports face-to-face and face-to-back bonding configurations with power-delivery network and signal-integrity co-optimization.
Chiplet Package Estimator
Estimate package dimensions, routing layer requirements, and assembly costs for multi-chiplet systems using silicon interposers, organic substrates, or glass substrates. Models UCIe link pitch, power-delivery integration, and thermal-mechanical stress for next-gen AI packaging.
HBM Cost Estimator
Calculate High Bandwidth Memory integration costs from HBM2E through HBM4, including TSV stack pricing, base-die logic, and 2.5D interposer overhead. Analyzes bandwidth-per-watt efficiency, capacity-per-package scaling, and supply-chain allocation for AI training and inference workloads.
Package Power Density Calculator
Estimate power density inside semiconductor packages with multi-die thermal stacking, hotspot identification, and cooling-path analysis. Supports AI accelerator packages exceeding 1,500W TDP with integrated TIM characterization and heat-spreader optimization.
Package Size Calculator
Determine package dimensions based on die count, substrate routing layers, I/O ball pitch, and thermal-management requirements. Optimizes for BGA, LGA, and custom form factors with DFM rule checking and warpage prediction for large-area AI packages.
Thermal Interface Material Calculator
Compare thermal interface solutions from traditional thermal greases to liquid metal, graphene sheets, and indium foil TIMs. Models thermal resistance, reliability under power cycling, and cost-per-watt-improvement for AI and HPC package-level cooling strategies.
Advanced Packaging Selector
Recommend optimal packaging technologies using AI-driven matching based on die count, power budget, bandwidth requirements, and cost constraints. Supports CoWoS, EMIB, FOEB, and chiplet architectures with automated trade-off visualization and vendor-agnostic benchmarking.
Interposer Cost Calculator
Estimate silicon interposer requirements and costs for 2.5D integration, including RDL layer count, TSV density, and wafer-area utilization. Models passive vs. active interposer trade-offs with yield impact and foundry pricing for CoWoS and EMIB-like implementations.
Keep the heat and the volts in budget